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tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 1 of 31 integrated transceiver modules for wlan 802.11 b/g/n, bluetooth. features ? ieee 802.11 b,g,n, d,e, i, compliant . ? typical wlan transmit power: o 20. 0 dbm, 11 mbp s , cck (b) . o 1 4 . 5 dbm, 54 mbps, ofdm (g) . o 12. 5 dbm, 65 mbps, ofdm (n) . ? bluetooth 2.1+edr, power class 1.5 . ? typical wlan sensitivity: o - 89 dbm, 8% per,11 mbps. o - 76 dbm, 10% per, 54 mbps. o - 7 3 dbm, 10% per, 65 mbps. ? miniature footprint: 18 mm x 13 mm ? low height profile: 1.9 mm . ? u.fl connector for external antenna . ? terminal for pcb/chip antenna feeds. ? integrated band - pass filter ? worldwide acceptance : fcc (usa), ic (canada), and etsi (europe) ? compact design based on texas instruments wl1271 wsp transceiver . ? seamless integration with ti omap? application processor. ? sdio host data path interfaces. ? b luetooth advanced audio interfaces ? low power operation mode. ? rohs compliant ? streamlined development with lsr design serv ic es. applications ? security ? hvac control , smart energy ? sensor networks ? medical description the tiwi module is a high performance 2.4 ghz ieee 802.11 b/g/n bluetooth 2.1+edr radio in a cost effective, pre - certified footprint. the module realizes the necessary phy/mac layers to support wlan applications in conjunction with a host processor over a sdio interface. the module also provides a bluetooth platform through the hci transport layer . both wlan and bluetooth share the same antenna port . need to get to market quickly? not an expert in 802. 11. or bluetooth ? need a custom antenna? would you like to own the design? would you like a custom design? not quite what you need? do you need help with your host board? ls research design services will be happy to develop custom hardw are or software, integrate the design, or license the design so you can manufacture yourself. contact us at sales@lsr.com or call us at 262 - 375- 4400.
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 2 of 31 ordering information order number description ls240 - wi - 01 - a20 this order number has been replaced with 450 - 0009 450 - 0009 tiwi - r1 module with u.fl c onnector for external antenna table 1 : orderable t i wi - r1 model numbers module accessories order number description 001- 0001 2.4 g hz dipole antenna with reverse polarity sma connector 080- 0001 u.fl to reverse polarity sma bulkhead cable 105mm end of life notifica tion the footprint of the tiwi - r1 is changing and the new model will be called tiwi - r2. please see footprint migration document (lsr # 330 - 0043) on the tiwi page at www.lsr.com/tiwi for more information.
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 3 of 31 block diagram wlan bt fm fem bpf wl1271 tps62611 tps73028 vbat vio slow_clk fast_clk host_signalling host_interface host_debug bt_tx_rx wl_rx wl_tx pa pa_bias pa_detector fem_control matching matching 2.4 ghz rf figure 1 : tiwi module block diagram ? top - level
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 4 of 31 table of contents features .......................................................................................................................... 1 applications ................................................................................................................... 1 description ..................................................................................................................... 1 ordering information ................................................................................................ 2 module accessories ................................................................................................... 2 end of life notifica tion ............................................................................................. 2 block diagram ............................................................................................................... 3 tiwi? module footpri nt and pin definitio ns ..................................................... 6 pin descriptions ............................................................................................................ 7 electrical specifica tions ........................................................................................ 9 absolute maximum ratings ....................................................................................................................... 9 recommended operating conditions ...................................................................................................... 9 general characteristics ............................................................................................................................ 10 wlan rf characteristics ......................................................................................................................... 12 bluetooth rf characteristics ............................................................................................................. 14 wlan power - up sequence ....................................................................................... 15 wlan power - down sequence ................................................................................. 16 bluetooth power - up sequence ............................................................................ 17 blue tooth power - down sequence ..................................................................... 18 enable scheme ............................................................................................................ 19 irq operation ............................................................................................................... 19 slow (32 khz) clock source requirements ..................................................... 20 bt hci uart ..................................................................................................................... 21 sdio interface timin g ................................................................................................ 22 sdio clock timing ........................................................................................................ 23
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 5 of 31 application schemati c ............................................................................................. 24 soldering recommenda tions ................................................................................ 25 recommended reflow profile ................................................................................................................. 25 lead (pb) free soldering paste ............................................................................................................... 25 cl eaning ..................................................................................................................................................... 25 optical inspection ..................................................................................................................................... 25 repeating reflow soldering .................................................................................................................... 25 wave soldering ......................................................................................................................................... 26 hand soldering .......................................................................................................................................... 26 rework ....................................................................................................................................................... 26 additional grounding ............................................................................................................................... 26 shipping, handling, and storage ......................................................................... 26 shipping ..................................................................................................................................................... 26 handling ..................................................................................................................................................... 26 moisture sensitivity level (msl) ............................................................................................................. 26 storage ....................................................................................................................................................... 26 agency certification s ............................................................................................. 26 mechanical data ......................................................................................................... 27 module revision hist ory ......................................................................................... 30 rev a .......................................................................................................................................................... 30 contacting ls resear ch ......................................................................................... 31
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 6 of 31 tiwi ? module footprint and pin definitions t o apply the tiwi ? module, it is important to use the module pins in your application as they are designated in below and in the corresponding pin definition table found on pages 7 and 8. not all the pins on the tiwi module may be used , as some are reserved for future functionalit y. figure 2 : tiwi ? pin definitions and generic module footprint vbat 1 gnd 2 bt_func5 3 gnd 4 wl_uart_dbg 5 wlan_irq 6 bt_en 7 fm_en 8 wl_rs232_rx 9 wl_rs232_tx 10 fm_i2s_fsync 11 wl_en 12 vio 13 gnd 14 sdio_d3 15 sdio_d2 16 sdio_d1 17 gnd 56 gnd 54 gnd 55 gnd 49 gnd 47 gnd 48 gnd 50 gnd 53 gnd 52 ant 51 vdd_ldo_class_1p5 46 bt_func4 45 bt_func2 44 aud_in 43 hci_cts 42 aud_out 41 aud_clk 40 hci_tx 39 hci_rts 38 hci_rx 37 aud_fsync 36 gnd 35 fm_aud_lout 34 fm_aud_rout 33 gnd 32 fmrfin 31 fmrfout 30 fm_irq 22 sdio_clk 20 slow_clk 21 sdio_cmd 19 sdio_d0 18 fm_i2s_do 27 fm_i2s_clk 25 fm_i2s_di 26 fm_scl 24 fm_sda 23 fm_aud_lin 29 fm_aud_rin 28 1.0 mm pitch througout 2.0 mm between antenna terminal and grounds 1.0 mm from each corner 13.0 mm 18.0 mm
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 7 of 31 pin descriptions module pin name i/o type buffer type description [termination if fm not used] 1 vbat pi - battery voltage 3.6 vdc nominal ( 3 . 0 - 4 . 8 vdc) 2 gnd gnd - ground 3 bt_func5 do 4 ma host_wu (*) 4 gnd gnd - ground 5 wl_uart_dbg dio 4 ma wl_uart_dbg 6 wlan_irq do 4 ma wlan interrupt request 7 bt_en di - bt_rst 8 fm_en di - fm_rst [gnd] 9 wl_rs232_rx di - wlan test uart rx (*) 10 wl_rw_232_tx do 4 ma wlan test uart tx (*) 11 fm_i2s_fsync do 4 ma fm_i2s_if [nc, open] (*) 12 wl_en di - wl_rst 13 vio p i - power supply for 1.8 vdc digital domain 14 gnd gnd - ground 15 sdio_d3 dio 8 ma sdio interface, host pull up 16 sdio_d2 dio 8 ma sdio interface, host pull up 17 sdio_d1 dio 8 ma sdio interface, host pull up 18 sdio_d0 dio 8 ma sdio interface, host pull up 19 sdio_cmd dio 8 ma host pull up 20 sdio_clk di - host pull up 21 slow_clk di - sleep clock (32 khz) , 1.8 vdc digital domain 22 fm_irq do 4 ma fm_i2c_if [ nc, open ] (*) 23 fm_sda do 4 ma fm_i2c_if [nc, open] (*) 24 fm_scl do 4 ma fm_i2c_if [nc, open] (*) 25 fm_i2s_clk do 4 ma fm_i2c_if [nc, open] (*) 26 fm_i2s_di di 4 ma fm_i2c_if [gnd] 27 fm_i2s_do do 4 ma fm_i2c_if [nc, open] (*) 2 8 fm_aud_rin ai - fm_aud_rin [gnd] 29 fm_aud_lin ai - fm_aud_lin [gnd] 3 0 fmrfout ao - fmrfout [nc, open ] 3 1 f mrfin ai - fmrfin [gnd ]
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 8 of 31 module pin name i/o type buffer type description [termination if fm not used] 3 2 gnd gnd - ground 3 3 fm_aud_rout ao - fm_aud_rout [nc, open] 3 4 f m_aud_lout ao - fm_aud_lout [nc,open] 3 5 gnd gnd - ground 3 6 aud_fsync dio 4 ma pcm i/f or fm_i2s_fsync 3 7 hci_rx di 8 ma bt uart i/f or btspi_din (*) 3 8 hci_rts do 4 ma bt uart i/f or btspi_irq (*) 39 hci_tx dio 8 ma bt uart i/f or btspi_dout 4 0 aud_clk do 4 ma pcm i/f or fm_i2s_clk (*) 4 1 aud_out do 4 ma pcm i/f or fm_i2s_do (*) 4 2 hci_cts di 4 ma bt uart i/f or btspi_cs (*) 4 3 aud_in di 4 ma pcm i/f or fm_i2s_di (*) 44 bt_func2 di 4 ma bt wu/ dc2dc mode (*) 45 bt_func4 d o 4 ma bt_uartd (debug) (*) 4 6 vdd_l d o_class_1p5 nc - vbat voltage present, no connect 4 7 gnd gnd - ground 48 gnd gnd - ground 49 gnd gnd - ground 5 0 gnd gnd - ground 5 1 ant rf antenna terminal for wlan and bluetooth (note [1]) 5 2 gnd gnd - ground 5 3 gnd gnd - ground 5 4 gnd gnd - ground 5 5 gnd gnd - ground 5 6 gnd gnd - ground pi = power input po = power output di = digital input do = digital output ai = analog input ao=analog output aio = bi - directional analog port rf = bi - directional rf por t gnd=ground note[ 1]: antenna terminal presents d.c. short circuit to ground. (*) indicates that pin is capable of bidirectional operation, but is used as the type shown. table 2 : t i wi module pin descriptions
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 9 of 31 electrical specifica tions the majority of these chara cteristics are based on controlling and conditioning the tests using the evaluation kit and tiwi control software application. other control conditions may require these values to be re - characterized by the customer. absolute maximum ratings parameter min max unit power s upply v oltage (v bat ) - 0. 5 + 5.5 v digital supply voltage (vio) - 0.5 2.1 v voltage on any gpio - 0. 5 vio + 0. 5 v voltage on any analog pins - 0.5 2.1 v rf i nput p ower, a ntenna p ort +10 dbm operating t emperature - 40 +85 oc storage t emperature - +1 0 5 oc table 3 : absolute maximum ratings 1 recommended operating conditions parameter min typ max unit v bat 3 . 0 3.6 4.8 v vio 1.62 1.8 1.92 v v ih 0.65 x vio - vio v v il 0 - 0.35 x vio v v oh @ 4, 8 ma vio - 0.45 - vio v v ol @ 4, 8 ma 0 - 0.45 v ambient t emperature r ange - 40 25 85 oc table 4 : recommended operating conditions 1 under no circumstances should exceeding the ratings specified in the absolute maximum ratings section be allowed . s tress ing the module beyond these limits may result permanent damage to the module that is not covered by the warranty.
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 10 of 31 general characteristics parameter min typ max unit wlan rf f requency r ange 24 12 24 72 mhz wlan rf d ata r ate 1 802.11 b/g/n rates supported 65 m bps bt rf frequency range 2402 2480 mhz table 5 general characteristics power consumption - wlan parameter test conditions min typ max unit cck (b) tx current 24 37 mhz, v bat =3.6 v, t amb = +25 c po= 20 dbm, 11 mbps cck l=1200 bytes, t delay (idle)=4 s. - 280 - ma ofdm (g) tx current 2437 mhz, v bat =3.6v, t amb =+25 c po=1 4 .5 dbm, 54 mbps ofdm l=1200 bytes, t delay (idle)= 4 s. - 185 - ma ofdm (n) tx current 2437 mhz, v bat =3.6v, t amb =+25 c po= 12.5 dbm, 65 mbps ofdm l=1200 bytes, t delay (idle)= 4 s. - 165 - ma cck (b) rx current - 100 - ma ofdm (g) rx current - 100 - ma ofdm (n) rx current - 100 - ma dynamic mode [1] - < 1. 2 - ma table 6 : wlan power consumption [1] total current from v bat for reception of beacons with dtim=1 tbtt=100 ms, beacon duration 1.6ms, 1 mbps beacon reception in listen mode.
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 11 of 31 power consumption - bluetooth parameter test conditions min typ max unit gfsk tx current constant transmit, dh5, prbs9 - 45 - ma edr tx current constant transmit, 2dh5,3dh5, prbs9 - 43 - ma gfsk rx current constant receive , dh1 - 35 - ma edr rx current constant receive , 2dh5, 3dh5 - 41 - ma deep sleep current deep sleep mode - 70 - a table 7 : bluetooth power consumption dc characteristics ? general purpose i/o parameter test conditions min typ max unit logic input low , v il 0 - 0.35 x vio v logic input high , v ih 0.65 x vio - vio v logic o utput low , v ol (full drive) iout = 8 ma 0 - 0.45 v iout = 4 ma 0 - 0.45 v logic o utput low , v ol (reduced drive) iout = 1 ma 0 - 0.112 v iout = 0.09 ma 0 - 0.01 v logic o utput high , v oh (full drive) iout = - 8 ma vio - 0.45 - vcc v iout = - 4 ma vio - 0.45 - vcc v logic o utput high , v oh (reduced drive) iout = - 1 ma vio - 0.112 - vcc v iout = - 0.3 ma vio - 0.033 - vcc v table 8 : dc characteristics general purpose i/o
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 12 of 31 wlan rf characteristics wlan transmitter characteristics ( t a =25c, v bat =3. 6 v ) parameter test conditions min typ max unit 11 mbps cck (b) tx output power 11 mbps cck , 802.11(b) mask compliance , 35% evm rms power over tx packet - 20 - dbm 9 mbps ofdm (g) tx output power 9 mbps ofdm , 802.11( g ) mask compliance , - 8 db evm rms power over tx packet - 19 - dbm 54 mbps ofdm (g) tx output power 54 mbps ofdm , 802.11( g ) mask compliance , - 25 db evm rms power over tx packet - 14.5 - dbm 6.5 mbps ofdm (n) tx output power 6.5 mbps ofdm , 802.11( n ) mask compliance , - 5 db evm rms power over tx packet - 19 - dbm 65 mbps ofdm (n) tx output power 65 mbps ofdm , 802.11( n ) mask compliance , - 28 db evm rms power over tx packet - 12.5 - dbm table 9 : wlan transmitter rf characteristics
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 13 of 31 wlan receiver characteristics ( t a =25c, v bat =3. 6 v ) [1] parameter test conditions min typ max unit 1 mbps cck (b) r x sensitivity 8% per - - 9 7 - dbm 11 mbps cck (b) rx sensitivity 8% per - - 89 - dbm 9 mbps ofdm (g) rx sensitivity 10 % per - - 9 0 - dbm 54 mbps ofdm (g) rx sensitivity 10 % per - - 76 - dbm 6.5 mbps ofdm (n) rx sensitivity 10 % per - - 9 1 - dbm 65 mbps ofdm (n) rx sensitivity 10 % per - - 7 3 - - dbm 11 mbps cck (b) rx overload level. 8% per - 10 - - dbm 6 mbps ofdm( g) rx overload level. 10% per - 20 - - dbm 54 mbps ofdm(g) rx overload level. 10% per - 20 - - dbm 65 mbps ofdm(n) rx overload level. 10% per - 20 - - dbm [1] up to 2 db degradation at channel 13 for 11g/n modes and up to 2 db degradation at channel 14 for 11b/g/n modes. table 10: wlan receiver rf characteristics
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 14 of 31 bluetooth rf characteristics b luetooth transmitter gfsk and edr characteristics, class 1.5 ( t a =25c, v bat =3. 6 v) parameter test conditions min typ max bt spec unit gfsk rf output power - 9.5 - - dbm edr rf output power - 7 - power control step size 2 4 8 2 - 8 db edr relative power - 2 1 - 4/+1 db table 11: bluetooth transmitter rf characteristics bluetooth receiver characteristics ( t a =25c, v bat =3. 6 v) parameter test conditions min typ max bt spec unit gfsk sensitivity ber=0.1% - - 92 - - 70 dbm edr 2 mbps sensitivity ber=0.01% - - 9 1 - - 70 dbm edr 3 mbps sensitivity ber=0.01% - - 8 2 - - 70 dbm gfsk maximum input level ber=0.1% - - 5 - - 20 dbm edr 2 maximum input level ber=0.1% - - 10 - - dbm edr 3 maximum input level ber=0.1% - - 10 - - - table 12 : bluetooth receiver rf characteristics
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 15 of 31 wlan power - up sequence a. after this sequence is completed, the device is in the low vio - leakage state while in shutdown. figure 4 - 1: tiwi power - up sequence requirements the following sequence describes device power - up from shutdown. only the wlan core is enabled; the bt and fm cores are disabled. 1. no signals are allowed on the io pins if no io power supplied, because the ios are not 'fail safe?. exceptio ns are clk_req_out, slowclk, xtalp and aud_xxx, which are failsafe and can tolerate external voltages with no vdds and dc2dc". 2. vbat,vio and slowclk must be available before wl_en. 3. t wakeup = t1 + t2 the duration of t1 is defined as the time from wl_en=high until fref is valid for the soc , t1 ~55ms the duration of t2 depends on: ? operating system ? host enumeration for the sdio/wspi ? pll configuration ? firmware download ? releasing the core from reset ? firmware initialization
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 16 of 31 wlan power - down sequence figure 4 - 2: tiwi module power - down sequence requirements 1. dc_req will go low only if wlan is the only core working. otherwise if another core is working (e.g bt) it will stay high. 2. clk_req will go low only if wlan is the only core working. otherwise if another core is working and using the fref (e.g bt) it will stay high. 3. if wlan is the only core that is operating, wl_en must remain de - asserted for at least 64 sec before it is re - asserted.
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 17 of 31 bluetooth power - up sequence the following sequence describes device power up from shutdown. only the bt core is enabled; the wlan core is disabled. power up requirements: 1. no signals are allowed on the io pins if no io power supplied, because the ios are not 'failsafe'. exceptions are clk_req_out, slowclk, xtalp and aud_xxx, which are failsafe and can tolerate external voltages with no vdds and dc2dc. 2. vdds and slowclk must be stable before releasing bt_en. 3. fast c lock must be stable maximum 55 ms after bt_en goes high. figure 4 - 3. bt power - up sequence
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 18 of 31 bluetooth power - down sequence figure 4 - 4. bt power - down sequence the tiwi module indicates completion of bt power up sequence by asserting rts low. this occurs up to 100 ms after bt_en goes high.
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 19 of 31 enable scheme the module has 3 enable pins, one for each core: wl_en, and bt_en and fm_en . presently, t here are 2 modes of active ope ration now supported: wlan and bt. it is recommended th at the fm_en pin be grounded to disable the fm section. it is also recommended that the fm section be disabled by bluetooth hci commands. 1. each core is operated independently by asserting each en to logic '1'. in this mode it is possible to control each core asynchronously and independently. 2. bt mode operation. wlan will be operated through wl_en asynchronously independently of bt irq operation 1. the default state of the wlan_irq prior to firmware initialization is 0. 2. during firmware initialization, the wlan_irq is configured by the sdio module; a wlan_irq changes its state to 1 . 3. a wlan firmware interrupt is handled as follows: a. the wlan firmware creates an interrupt - to - host, indicated by a 1 - to - 0 transition on the wlan_irq line (host must be configured as active - low or falling - edge detect). b. after the host is available, depending on the interrupt priority and other host tasks, it ma sks the firmware interrupt. the wlan_irq line returns to 1 (0 - to - 1 transition on the wlan_irq line). c. the host reads the internal register status to determine the interrupt sources - the register is cleared after the read . d. the host processes in sequence a ll the interrupts read from this register e. the host unmasks the firmware interrupts. 4. the host is ready to receive another interrupt from the wlan device.
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 20 of 31 slow (32 khz) clock source requirements characteristics (1) condition sym min typ max unit input slow clock frequency 32768 hz input slow clock accuracy wlan, bt 150 ppm input transition time tr/tf -10% to 90% tr/tf 100 ns frequency input duty cycle 30 50 70 % input voltage limits square wave, dc-coupled vih 0.65 x vdds vdds vpeak vil 0 0.35x vdds input impedence 1 mw input capacitance 5 pf rise and fall time 100 ns phase noise 1 khz C125 dbc/hz 1) slow clock is a fail safe input
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 21 of 31 bt hci uart
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 22 of 31 sdio interface timin g
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 23 of 31 sdio clock timing
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 24 of 31 ap plication schematic
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 25 of 31 soldering recommendations recommended reflow profile ? ramp up rate (fro m tsoakmax to tpeak) 3o/sec max ? minimum soak temperature 150 c ? maximum soak temperature 200 c ? soak time 60 - 120 sec ? tliquidus 217 c ? time above tl 60 - 150 sec ? tpeak 260 c ? ti me within 5o of tpeak 20 - 30 sec ? t ime from 25o to tpeak 8 min max ? ramp down rate 6 c/sec max ? achieve the brightest possible solder fillets with a good shape and lo w contact angle. lead (pb) free soldering paste use of a ?no clean? lead (pb) free tin/silver/copper solder paste is strongly recommended. melting temperature 216 - 221 c . note: the quality of solder joints on the castellations (?half vias?) where they contact the host board should meet the appropriate ipc specification . see ipc - a - 610- d acceptability of electronic assemblies, section 8.2.4 castellated terminations.? the soldering temperatures and profile chosen depends on additional factors such as choi ce of soldering paste, size, thickness and other properties of the host board. cleaning in general, cleaning the populated modules is strongly discouraged . residuals under the module cannot be easily removed with any cleaning process. ? cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module . the combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads . water could also damage an y stickers or labels. ? cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the rf shield , which is not accessible for post - washing inspection . the solvent could also damage any stickers or labels. ? ultrasonic c leaning could damage the module permanently . consider using a ?no clean? soldering paste and thus eliminate the post - soldering cleaning step completely . optical inspection after soldering the module to the host board, consider optical inspection to check t he following: ? proper alignment and centering of the module over the pads. ? proper solder joints on all pads. ? excessive solder or contacts to neighboring pads, or vias. repeating reflow soldering only a single reflow soldering process is encouraged for host boards.
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 26 of 31 wave soldering if wave soldering is required on the host boards due to the presence of leaded components, only a single wave soldering process on the side opposite the module is encouraged . hand soldering hand soldering is possible . use a solder ing iron temperature setting equivalent to 350c, follow ipc recommendations/reference document ipc - 7711. rework the tiwi m odule can be unsoldered from the host board . use of a hot air rework tool and hot plate for pre - heating from underneath is recommend ed . avoid overheating. never attempt a rework on the module itself, e.g . replacing individual components . such actions will terminate warranty coverage. additional grounding attempts to improve module or system grounding by soldering braids, wires, or cables onto the module rf shield cover is done at the customers own risk . the numerous ground pins at the module perimeter should be sufficient for optimum immunity to external rf interference. ship ping , handling, and stor age ship ping bulk orders of t he tiwi modules are delivered in trays of tbd . handling the tiwi modules are designed and packaged to be processed in an automated assembly line. warning ! the tiwi modules contain a highly sensitive electronic circuitry . handling without proper esd protecti on may destroy or damage the module permanently . warning ! according to jedec isp, the tiwi modules are moisture sensitive devices . appropriate handling instructions and precautions are summarized in section 2.1 . read carefully to prevent permanent damag e due to moisture intake . moisture sensitivity level (msl) msl 3, per j - std - 033 storage storage/shelf life in sealed bags is 12 months at <40c and <90% relative humidity. agency certification s fcc id: tbd , 15.247. ic id: tbd , rss 210 etsi: t he european telecom munications standards institute. it produces the radio and communication standards for europe . our testing is to the etsi standard en 300 328 , which is the portion of the relevant directives needed for a radio to obtain a ce mark. see the user?s guide for detailed information regarding agency approvals.
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 27 of 31 mechanical data this footprint may not be suitable for new designs. please see footprint migration document (lsr # 330- 0043) on the tiwi page at www.lsr.com/tiwi for more information. figure 4: module mechanical dimensions ( maximum module height = 1.9 mm ) figure 5: soldering footprint for host board and module placement 1.0 mm pitch througout 2.0 mm between antenna terminal and grounds 1.0 mm from each corner 13.0 mm 18.0 mm
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 28 of 31 figure 6: host board pad array placement dimensioning.
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 29 of 31 device markings rev 0 devices wl1271 silicon rev front end 2. 1 tqm679002 where rr = revision xxxxxx = i n cremental serial number
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 30 of 31 module revision hist ory rev a ? initial production release.
tiwi - r1 transceiver module datasheet the information in this document is subject to change without notice. confirm the data is current by downloading the latest revision from www.lsr.com. 330- 0041 - rev2. 4 copyright ? 2010 ls research, llc page 31 of 31 contacting ls resear ch headquarters ls research, llc w66 n220 commerce court cedarburg, wi 53012 - 2636 usa tel: 1(262) 375 - 4400 fax: 1(262) 375 - 4248 website www.lsr.com technical support support@lsr.com sales contact sales@lsr.com the information in this document is provided in connection with ls research (hereafter referred to as ?lsr?) products. no license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of lsr products. except as set forth in lsr?s terms and conditions of sale located on lsr?s web site, lsr assumes no liability whatsoever and disclaims any express, implied or statutory warranty relating to its products including, but not li mited to, the implied warranty of merchantability, fitness for a particular purpose, or non - infringement. in no event shall lsr be liable for any direct, indirect, consequential, punitive, special or incidental damages (including, without limitation, damag es for loss of profits, business interruption, or loss of information) arising out of the use or inability to use this document, even if lsr has been advised of the possibility of such damages. lsr makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. lsr does not make any commitment to update the information contained herein. unless spe cifically provided otherwise, lsr products are not suitable for, and shall not be used in, automotive applications. lsr?s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.

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